Klein Tools Thermal Imager TI223 Mobile USB-C Infrared Camera (19200 Pixel Sensor -4 to 752F Hot Cold Spot Differential HVAC Electrical Tester)

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SKU: TI223
Regular price $299.99 USD

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Visualize Overloaded Circuit Panels and Trace Mechanical Energy Friction Instantly with High Pixel Density Smartphone Infrared Imaging Matrix

Shop the Klein Tools TI223 mobile thermal imager engineered to adapt USB-C smartphones into high-resolution infrared diagnostic inspection cameras. This device captures 19,200 pixel matrix footprints across a temperature scale from -4°F to 752°F to evaluate structural panel anomalies and hidden fluid blockages. Operating via host phone power with a thermal sensitivity under 50 mK and an adjustable emissivity track, it isolates high-resistance wiring faults and energy transfer deficiencies through thick appliance cases without demanding structural component disassembly.

Best Used For:

  • Electrical Panel Scans: Interfacing with smartphone ports to isolate overheating circuit breaker lugs and unbalanced phases up to 752°F.
  • HVAC Duct Inspections: Mapping real-time thermal transfer leaks across insulation boundaries, air handler trunks, and furnace vents.
  • Mechanical Wear Diagnosis: Tracing friction-induced heat blooms in industrial motor bearings, pump shafts, and drive belt tracks.

Key Performance & Safety Features

  • 19200 Pixel Micro-Matrix: Dense focal plane sensor captures sharp structural heat gradients to pinpoint minor electrical resistance issues.
  • Case-Friendly USB-C Link: Elongated connector stalk slides securely into smart devices through shielding frames up to 1/5-inch thick.
  • High-Sensitivity Detection: Thermal resolution rating lower than 50 mK exposes minor environmental heat variations for micro-leak monitoring.
  • Differential Delta-T App Logic: Interactive interface app calculates maximum, minimum, and center-spot variances concurrently for fast site comparisons.
  • Anodized Metal Shielding: Rugged structural aluminum outer housing defends solid-state camera optics from jobsite contact wear.

What's Included

  • TI223 Mobile Thermal Imager (USB-C)
  • Hard Protective Storage Case
  • Aluminum Carabiner
  • Instruction Manual

Technical Specifications

Thermal Sensor Resolution: 19,200 Pixels (160 x 120 Array)
Monitored Temperature Span: -4° to 752° F
Thermal Sensitivity (NETD): < 50 mK
Optical Field of View: 56° Horizontal x 71° Diagonal
Hardware Interface Port: USB-C Connector (Elongated Neck)
Standard Sensor Accuracy: ±3.6°F (±2°C) or ±2% (Whichever Value is Greater)
Surface Emissivity Profile: Adjustable from 0.01 to 0.99 Coefficient
Image Refresh Frame Rate: < 9 Hz Frequency
Chassis Compound Material: Ruggedized Structural Aluminum
Imager Component Length: 1.77 Inches
Imager Component Height: 1.23 Inches
Net Accessory Base Weight: 0.9 oz.
Pro-Tip: When examining reflective surfaces like polished raw copper pipelines or aluminum distribution bars, configure the app emissivity down or apply matte electrical tape to the target area; this balances radiation capturing to guarantee clean accuracy.