Klein Tools Thermal Imager TI223 Mobile USB-C Infrared Camera (19200 Pixel Sensor -4 to 752F Hot Cold Spot Differential HVAC Electrical Tester)
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$299.99 USD
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Visualize Overloaded Circuit Panels and Trace Mechanical Energy Friction Instantly with High Pixel Density Smartphone Infrared Imaging Matrix
Shop the Klein Tools TI223 mobile thermal imager engineered to adapt USB-C smartphones into high-resolution infrared diagnostic inspection cameras. This device captures 19,200 pixel matrix footprints across a temperature scale from -4°F to 752°F to evaluate structural panel anomalies and hidden fluid blockages. Operating via host phone power with a thermal sensitivity under 50 mK and an adjustable emissivity track, it isolates high-resistance wiring faults and energy transfer deficiencies through thick appliance cases without demanding structural component disassembly.
Best Used For:
- Electrical Panel Scans: Interfacing with smartphone ports to isolate overheating circuit breaker lugs and unbalanced phases up to 752°F.
- HVAC Duct Inspections: Mapping real-time thermal transfer leaks across insulation boundaries, air handler trunks, and furnace vents.
- Mechanical Wear Diagnosis: Tracing friction-induced heat blooms in industrial motor bearings, pump shafts, and drive belt tracks.
Key Performance & Safety Features
- 19200 Pixel Micro-Matrix: Dense focal plane sensor captures sharp structural heat gradients to pinpoint minor electrical resistance issues.
- Case-Friendly USB-C Link: Elongated connector stalk slides securely into smart devices through shielding frames up to 1/5-inch thick.
- High-Sensitivity Detection: Thermal resolution rating lower than 50 mK exposes minor environmental heat variations for micro-leak monitoring.
- Differential Delta-T App Logic: Interactive interface app calculates maximum, minimum, and center-spot variances concurrently for fast site comparisons.
- Anodized Metal Shielding: Rugged structural aluminum outer housing defends solid-state camera optics from jobsite contact wear.
What's Included
- TI223 Mobile Thermal Imager (USB-C)
- Hard Protective Storage Case
- Aluminum Carabiner
- Instruction Manual
Technical Specifications
| Thermal Sensor Resolution: | 19,200 Pixels (160 x 120 Array) |
| Monitored Temperature Span: | -4° to 752° F |
| Thermal Sensitivity (NETD): | < 50 mK |
| Optical Field of View: | 56° Horizontal x 71° Diagonal |
| Hardware Interface Port: | USB-C Connector (Elongated Neck) |
| Standard Sensor Accuracy: | ±3.6°F (±2°C) or ±2% (Whichever Value is Greater) |
| Surface Emissivity Profile: | Adjustable from 0.01 to 0.99 Coefficient |
| Image Refresh Frame Rate: | < 9 Hz Frequency |
| Chassis Compound Material: | Ruggedized Structural Aluminum |
| Imager Component Length: | 1.77 Inches |
| Imager Component Height: | 1.23 Inches |
| Net Accessory Base Weight: | 0.9 oz. |
Pro-Tip: When examining reflective surfaces like polished raw copper pipelines or aluminum distribution bars, configure the app emissivity down or apply matte electrical tape to the target area; this balances radiation capturing to guarantee clean accuracy.
